Join Mixel at the 2025 North America TSMC Technology Symposium. Stop by our booth where we will be exhibiting our latest customer demos such Mixel’s MIPI C-PHY/D-PHY IP integrated in the Hercules Microelectronics HME-H3 low-power FPGA, in production in foldable smartphones such as the Blackview Hero 10. We will also be demonstrating ams OSRAM’s Mira050 CMOS image sensor for low power industrial and consumer IoT applications featuring Mixel’s MIPI D-PHY CSI-2 TX+ IP in at TSMC 40nm process. Learn more about our which is now available in TSMC’s Advanced Nodes including N5, N6, and N7.
