Mixel Inc | Mixed-Signal Excellence

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Semiwiki
MIPI solutions for driving dual-display foldable devices
Semiconductor Engineering
Partitioning In The Chiplet Era
Semiconductor Engineering
Accellera Preps New Standard For Clock-Domain Crossing
Semiconductor Engineering
AI Tradeoffs At The Edge
Semiwiki
2024 Outlook with Justin Endo of Mixel
Semiconductor Engineering
Glitch Power Issues Grow At Advanced Nodes
Semiconductor Engineering
2023: A Good Year For Semiconductors
Semiconductor Engineering
Using Real Workloads To Assess Thermal Impacts
Semiwiki
Automotive-grade MIPI PHY IP Drives Multi-sensor Solutions
Semiwiki
CEO Interview: Ashraf Takla of Mixel
Semiconductor Engineering
EDA’s Role Grows For Preventing And Identifying Failures
Semiwiki
MIPI D-PHY IP brings images on-chip for AI inference
Semiconductor Engineering
MIPI’s Focus Widens
Semiconductor Engineering
Chiplets Taking Root As Silicon-Proven Hard IP
Semiconductor Engineering
Growing System Complexity Drives More IP Reuse
Semiwiki
MIPI bridging DSI-2 and CSI-2 Interfaces with an FPGA
Semiwiki
MIPI in the Car – Transport From Sensors to Compute
Semiconductor Engineering
AI Feeds Vision Processor, Image Sensor Boom
Semiconductor Engineering
Complex Tradeoffs In Inferencing Chips
Semiconductor Engineering
Heterogenous Integration Creating New IP Opportunities
Semiconductor Engineering
Using AI To Speed Up Edge Computing
Semiconductor Engineering
IP Industry Transformation
Semiconductor Engineering
MIPI Standards Gaining Traction In New Markets
Semiconductor Engineering
Innovations In Sensor Technology
EE World Online
MIPI C-PHY/D-PHY combo speeds development of high-bandwidth displays
Semiwiki
A MIPI CSI-2/MIPI D-PHY Solution for AI Edge Devices
Semiconductor Engineering
New Power, Performance Options At The Edge
Semiconductor Engineering
Innovation in C-PHY
Semiconductor Engineering
Battle Brewing Over Automotive Display Protocols
Semiconductor Engineering
Many Chiplet Challenges Ahead
Semiwiki
FD-SOI Offers Refreshing Performance and Flexibility for Mobile Applications
Semiconductor Engineering
Re-Architecting SerDes
Semiconductor Engineering
The Expanding Universe Of MIPI Applications
Semiconductor 360
Mixel on Semiconductor 360
Semiconductor Engineering
Week In Review: Design, Low Power
Semiwiki
New Processor Helps Move Inference to the Edge
Semiwiki
Mixel Makes Major Move on MIPI D-PHY v2.5
MIPI Alliance
MIPI Alliance Presents Distinguished Service Award To Mixel President And CEO
Embedded Advisor
Embedded Advisor Recognizes Mixel as a Top 20 Electronics Design & Solutions Provider
MIPI Alliance
Mixel Participating in Development of New MIPI Specifications Targeting Automotive Applications at 12-24 Gbps and Beyond
Business Wire
Mixel, Inc. participating in New MIPI Alliance Group Addressing Interface Specifications for Automotive Applications
Business Wire
Lattice Semiconductor’s iCE40 FPGA Enables Low Latency and Concurrent Sensor Processing in SteamVR Tracking
Business Wire
Lattice Semiconductor Further Expands CrossLink Applications with Modular IP Cores. Mixel MIPI PHY IP is inside.
Business Wire
Lattice Semiconductor Expands CrossLink Programmable ASSP (pASSP) IP Solutions
NXP
NXP Quadruples Computing Power for Automotive Radar to Enable New Range of Semi-Autonomous Capabilities. Mixel provided the MIPI interface for this innovative NXP product.
Touch Display Research
Automotive is hot topic at MIPI DevCon 2016
EECatalog
Mixel Inc. and Northwest Logic announced the availability of their unified MIPI® platform, incorporating the Mixel MIPI D-PHY (Physical Layer) and the Northwest Logic MIPI CSI-2 and DSI Controllers.
Design & Reuse
ROHM First to Market with Mixel’s Unified MIPI/MDDI PHY IP Solution in Its Mobile Display Driver Chip
EETimes Europe
The curtain is up and the M-PHY specification is taking center stage, positioned to handle the many different roles required for a faster, more reliable, physical interface layer (PHY Layer) on mobile devices.
Design & Reuse
The curtain is up and the M-PHY specification is taking center stage. It is positioned to handle the many different roles required for a faster, more reliable, physical interface layer (PHY) on mobile devices.
Design & Reuse
Mixel® Inc., the leader in mobile mixed-signal Intellectual Property (IP) announced today that Graphin™ will license the Mixel M-PHY IP and that the two companies will collaborate to produce a “Golden M-PHY” IC to be used in Graphin’s evaluation systems.
EDACafe
Mixel® Inc., the leader in mobile Mixed-Signal IP (Intellectual Property) announced today that Canesta is using Mixel’s MIPI D-PHY.
ChipDesign
Mixel and Northwest Logic Partner MIPI IP Solution
Design & Reuse
Mixel’s MIPI D-PHY Transceiver IP in use on California Micro Devices CM5160 Chip
EDACafe
Faraday and Mixel Announce IP Development and Licensing Partnership
EEProducts
Mixel Inc. today announced availability of the MXL-PHY-MIPI, a MIPI (Mobile Industry Peripheral Interface) standard D-PHY virtual component Intellectual Property (IP).
EDACafe
Mixel announces two new PLLs featuring higher performance, reduced power, cost and die area at the 2007 FSA Expo and Conference
EDACafe
Mixel Announces the Availability of Its 4.25 Gbps High Performance, Highly Programmable, SerDes IP’s Characterization Report
EDACafe
Mixel Showcases the Newest Members of Its SerDes IP Family, Quad 1.25Gbps/Channel LVDS Serializer and De-Serializer at DesignCon2007
EDACafe
Mixel Announces First Silicon-Proven Mobile Display Digital Interface Transceiver IP for Digital Handsets